About iCometrue
iCometrue® was founded in 2012 with a mission to inspire, imagine, innovate and invent fundamental, disruptive and positive technology. iCometrue is also actively exploring and articulating the insight of the birth and growth of the semiconductor integrated circuit (IC) chip abiding by the amazing Moore’s law based on the observation of Nature’s gifted setups and human’s talent craftmanship. Further, in view of the awesome magic power of the IC chip when the number of transistors in it is close to trillions, iCometrue is also dedicated to promote the Ethic Engineering to avoid possible mis-use of the magic power by human with bad intention.
iCometrue® was founded in 2012 with a mission to inspire, imagine, innovate and invent fundamental, disruptive and positive technology. iCometrue is also actively exploring and articulating the insight of the birth and growth of the semiconductor integrated circuit (IC) chip abiding by the amazing Moore’s law based on the observation of Nature’s gifted setups and human’s talent craftmanship. Further, in view of the awesome magic power of the IC chip when the number of transistors in it is close to trillions, iCometrue is also dedicated to promote the Ethic Engineering to avoid possible mis-use of the magic power by human with bad intention.
The major projects of iCometrue are:
1.Logic Drive:
The Logic Drive uses advanced package technology to package one or multiple FPGA (Field Programmable Gate Array) chiplets fabricated by technology more advanced than 10 nm and a Non-Volatile Memory (NVM) chip for storing the configuration and re-configuration data of the FPGA chiplets in a multi-chip package. iCometrue proposed to standardize the FPGA chiplet in the logic drive and to turn it into a commodity product like DRAM or Flash memory chip, such that the FPGA chiplet becomes cost effective, user friendly, and easy for wide promotion. Logic Drive has two significant breakthroughs: (i) bringing back the “Public Innovation Platform” to the semiconductor foundry industry for talent and creative IC designers with limited funding to participate in design using the expensive advanced process technologies, such as 7 nm or 5 nm. Talent and creative IC designers may write programming codes to configure the hardware circuits of the FPGA IC chip and store the programming codes in the non-volatile flash memory IC chip in the same multichip package. The configured non-volatile Logic Drive may be sold as an ASIC chip; and (ii) turning the current ASIC IC industry into a standard commodity logic IC industry like the current DRAM and Flash standard commodity memory IC industry. The Logic Drive is like the Solid-State Drive or Solid-State Disk (SSD); the only difference is that SSD is for storing data memory, while Logic Drive is for storing computing logic.
The Logic Drive uses advanced package technology to package one or multiple FPGA (Field Programmable Gate Array) chiplets fabricated by technology more advanced than 10 nm and a Non-Volatile Memory (NVM) chip for storing the configuration and re-configuration data of the FPGA chiplets in a multi-chip package. iCometrue proposed to standardize the FPGA chiplet in the logic drive and to turn it into a commodity product like DRAM or Flash memory chip, such that the FPGA chiplet becomes cost effective, user friendly, and easy for wide promotion. Logic Drive has two significant breakthroughs: (i) bringing back the “Public Innovation Platform” to the semiconductor foundry industry for talent and creative IC designers with limited funding to participate in design using the expensive advanced process technologies, such as 7 nm or 5 nm. Talent and creative IC designers may write programming codes to configure the hardware circuits of the FPGA IC chip and store the programming codes in the non-volatile flash memory IC chip in the same multichip package. The configured non-volatile Logic Drive may be sold as an ASIC chip; and (ii) turning the current ASIC IC industry into a standard commodity logic IC industry like the current DRAM and Flash standard commodity memory IC industry. The Logic Drive is like the Solid-State Drive or Solid-State Disk (SSD); the only difference is that SSD is for storing data memory, while Logic Drive is for storing computing logic.
2.Field Programmable Multichip Package (FPMCP)
FPMCP is formed by packaging one or more FPGA chips, a Non-Volatile Memory (NVM) chip, one or more logic computing chips and one or more auxiliary chips in a single package by using the advanced multi-chip packaging technologies. Through configuring or re-configuring the FPGA chip in the FPMCP, the FPGA chip could work with the other chips in the same package to provide various functions, therefore, increase the application flexibility of the multi-chip package, and turns the FPMCP into an Application Specific Multi-Chip Package (ASMCP) for specific applications.
FPMCP is formed by packaging one or more FPGA chips, a Non-Volatile Memory (NVM) chip, one or more logic computing chips and one or more auxiliary chips in a single package by using the advanced multi-chip packaging technologies. Through configuring or re-configuring the FPGA chip in the FPMCP, the FPGA chip could work with the other chips in the same package to provide various functions, therefore, increase the application flexibility of the multi-chip package, and turns the FPMCP into an Application Specific Multi-Chip Package (ASMCP) for specific applications.
3.Glass Panel with embedded Through-Glass-Via (TGV) Connectors
With its high Young’s modulus and a coefficient of thermal expansion closely matched to silicon, glass demonstrates excellent mechanical and thermal properties, making it the optimal material choice for large-size, advanced multi-chip packaging. Glass substrates embedded with TGV Connectors provide a practical and scalable alternative to existing TGV processes. Examples of two applications: (i) Glass Interposer: providing a better alternative for Si Interposer and Molded Substrate with Embedded Silicon Bridges (ii) PCB with Glass Core: using Glass Panel with embedded TGV Connectors as the Core of PCB to provide high mechanical strength and reliability of large-size PCB
With its high Young’s modulus and a coefficient of thermal expansion closely matched to silicon, glass demonstrates excellent mechanical and thermal properties, making it the optimal material choice for large-size, advanced multi-chip packaging. Glass substrates embedded with TGV Connectors provide a practical and scalable alternative to existing TGV processes. Examples of two applications: (i) Glass Interposer: providing a better alternative for Si Interposer and Molded Substrate with Embedded Silicon Bridges (ii) PCB with Glass Core: using Glass Panel with embedded TGV Connectors as the Core of PCB to provide high mechanical strength and reliability of large-size PCB
4.Ultra-Thin Vapor Chamber (UTVC)
The Ultra-Thin Vapor Chamber (UTVC) using thin-film process technology to create vapor chamber as thin as 100–200 μm. In view of its ultrathin thickness, the liquid/vapor close loop and light weight, our UTVC is suitable for use in the portable devices, such as smartphones, laptops, AR/VR headsets, and smart glasses.
The Ultra-Thin Vapor Chamber (UTVC) using thin-film process technology to create vapor chamber as thin as 100–200 μm. In view of its ultrathin thickness, the liquid/vapor close loop and light weight, our UTVC is suitable for use in the portable devices, such as smartphones, laptops, AR/VR headsets, and smart glasses.
TOP